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Graduate School of Engineering/Department of Mechanical Engineering and Science /
Materials Science Laboratory

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ナノスケールのき裂伝ぱ試験

Griffith Criterion for Nanoscale Stress Singularity in Brittle Silicon
Takashi Sumigawa, Takahiro Shimada, Shuhei Tanaka, Hiroki Unno, Naoki Ozaki, Shinsaku Ashida, and Takayuki Kitamura
ACS Nano, Vol. 11 (6) (2017), pp. 6271?6276.
http://pubs.acs.org/doi/abs/10.1021/acsnano.7b02493

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Fracture Toughness of Silicon in Nanometer-scale Singular Stress Field
Takashi Sumigawa, Shinsaku Ashida, Shuhei Tanaka, Kazunori Sanada, and Takayuki Kitamura
Engineering Fracture Mechanics, Vol. 150 (2015) pp. 161?167.
doi:10.1016/j.engfracmech.2015.05.054

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界面端・内部き裂発生

Interface crack initiation due to nano-scale stress concentration
Takashi Sumigawa, Tetsuya Shishido, Tadashi Murakami, and Takayuki Kitamura
Materials Science and Engineering A,Vol. 527,18-19, (2010) pp. 4796-4803
https://doi.org/10.1016/j.msea.2010.04.002

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Strength Evaluation of Selected Interface in Multi-layered Nano-material
Yan Yabin, Takashi Sumigawa, Licheng Guo, Takayuki Kitamura
Engineering Fracture Mechanics, Vol. 116 (2014) pp. 204-212.
DOI: 10.1016/j.engfracmech.2013.12.014

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Fracture Mechanics Investigation on Crack Propagation in the Nano-multilayered Materials
Licheng Guo, Takayuki Kitamura, Yabin Yan, Takashi Sumigawa, Kai Huang
International Journal of Solids and Structures, Vol. 64?65 (2015) pp. 208?220.
DOI: 10.1016/j.ijsolstr.2015.03.025

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曲げねじり試験
Mixed-mode crack initiation at the edge of Cu/Si interface due to nanoscale stress concentration
Kohei Kishimoto, Yabin Yan, Takashi Sumigawa, Takayuki Kitamura
Engineering Fracture Mechanics, Vol. 96 (2012) pp. 72-81.
DOI: 10.1016/j.engfracmech.2012.07.027

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疲労試験

In situ observation on formation process of nanoscale cracking during tension-compression fatigue of single crystal copper micron-scale specimen
Takashi Sumigawa, Kim Byungwoon, Yuki Mizuno, Takuma Morimura, and Takayuki Kitamura
Acta Materialia, Vol. 153 (2018) pp. 270-278.
DOI: https://doi.org/10.1016/j.actamat.2018.04.061

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Cu/Si Interface Fracture due to Fatigue of Copper Film in Nanometer Scale
Takashi Sumigawa, Tadashi Murakami, Tetsuya Shishido, and Takayuki Kitamura
Material Science and Engineering A, Vol. 527 (2010) pp. 6518-6523.
DOI: 10.1016/j.msea.2010.07.002

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ナノスプリングの引張試験

In situ observation of tensile behavior in a single silicon nanospring
Takashi Sumigawa, Shaoguang Chen, Tetsuya Yukishita, Takayuki Kitamura
Thin solid films, Vol. 636 (2017) pp. 70-77.
DOI: https://doi.org/10.1016/j.tsf.2017.05.036

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京都大学北村研で作成したオリジナルムービーです

・桂キャンパスCクラスタ  

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・桂キャンパスからの夜景

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・吉田キャンパス

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